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Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade

    Buy cheap Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade from wholesalers
     
    Buy cheap Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade from wholesalers
    • Buy cheap Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade from wholesalers
    • Buy cheap Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade from wholesalers

    Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade

    Ask Lasest Price
    Brand Name : TONGYU INDUSTY
    Model Number : RTR1A8-006
    Price : Usd30-50 Per Piece Fob
    Payment Terms : T/T, L/C, D/P, Western Union
    Supply Ability : 10,000pcs per Month
    Delivery Time : 7-20days
    • Product Details
    • Company Profile

    Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade

    0.2MM Thick Ultrathin Resin Bonded Diamond Dicing Blade for High Precision Cutting

    Super Hard Material Cutting Tools, also called Dicing Wheel or Saw Blade


    Sample blade specification: 58*40*0.2mm ( D * H * T)


    We use resin powder to increase the flexibility of cutting blades in order to supply high performace of flexible cutting

    for many objects. such like to Semiconductor,Optical Glass, Ceramics, Magnetic Material etc.


    Diamond wheel shape and indicates:


    D -- Out Diameter

    H -- Inner Diameter

    W-- Thickness



    W (mm)

    D (mm)


    H (mm)

    0.1-1.0


    50-120


    32, 40, 52, 70



    Feature of our Diamond Blade:


    1. Excellent self-sharpness and cutting ability which can help reduce chipping, fractures and achive smooth surface finish

    2. High wear resistance.

    3. Ultra high precision diamond blades suitable for any single piece cutting and multi slices combined cutting.

    4. High rigdity, high strength, high performance for damage resistance.

    5. Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc

    6. Different products formula and crafts can meet different processing objects.

    7. All products are adapting high class diamond powder to ensure the cutting performance and long service life.

    8. High qualiy blade with resonable costs to you.


    Applications Of Resin Bond Dicing Blade

    Glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN (copper epoxy molding ), splitter, sapphire




    More image of our Dicing Blade



    Description of special cutting chip for PCB, single crystal and silicon wafer:


    High precision cutting wheel is formed by diamond or CBN abrasive layer. According to different uses, We choose metal, resin, ceramics and other different binders to achieve the best cutting effect.


    In addition, it can also complete the processing of V-shape or R-shape and other blade shapes. It is suitable for all kinds of materials to be cut, and it is a widely used cutting wheel.


    Main features: 1. High precision, can be used for precision slotting and cutting; 2. Ultra-thin thickness, can save a lot of valuable materials; 3. High rigidity, high strength, long service life; 4. Sharp cutting, high processing efficiency.


    Main cutting materials: diamond cutting wheel is mainly used for slotting and cutting processing of various non-metallic materials, It includes: 1. Semiconductor and its packaging materials; 2. Ceramic materials; 3. Magnetic materials; 4. Other materials: crystal, glass, quartz, gem, cemented carbide, printed circuit board, etc. CBN cutting wheel is mainly used for grooving and cutting processing of various high hardness ferrous metal materials, including tool steel, die steel, bearing steel, heat-resistant steel, stainless steel,Cast iron and other hard ferrous metals.


    FAQ:
    Q: Do you accept trial order?
    A: Yes, small order is available here.
    Q: Do you provide samples ? is it free ?
    A: Yes, we could offer the sample free of charge, but clients would bear for the courier freight charges.


    Q: How long is your delivery time?
    A: Usually 3 days for ready stocklots. and 5-15 days for new customed order, it is according to
    quantity.

    Q: What is your terms of payment?
    A: T/T, Western Union, Paypal, L/C, others.
    Q: Can you provide OEM service?
    A: Yes, we can produce the goods with clients' logo and brand.



    Over 15 years of developing and producing experience in high precision super hard material tools, we have

    established a high efficiency system to provide stable performance wheel products.


    We welcome yr free inquiry for any question in our diamond cutting wheels. In order to supply exact wheel

    type and quotation to you, if possible, better for you to provide us more information like followings:


    1. Yr processing objects.

    2. Yr OD, ID, Thickness data.

    3. Grit size if possible.

    4. Rotary speed of your processing machine.


    Many Thanks.




    Quality Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade for sale
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